• Couplings
  • Slit Type


Cleanroom / Vacuum / Heat Resistant Couplings - Slit Type (PEEK) - Clamping Type

  • A Trace of Outgas
  • Made of PEEK

Dimension Drawing

MSXP-CCleanroom / Vacuum / Heat Resistant Couplings - Slit Type (PEEK) - Clamping Type寸法図


Part Number ALWFGM Screw Tightening
Torque (N・m)
Add to Cart
MSXP-30C-12-12 30 10.2 30 5.1 9 M3 0.15 159.96 CAD Cart

Part Number Max. Bore Diameter
Max. Rotational Frequency
Moment of
Max. Lateral Misalignment
Max. Angular
Max. Axial
(g) *2
MSXP-30C-12-12 12 1 21000 7.8×10-7 180 0.05 0.5 ±0.1 6.8

※ The selected shaft's slip torque is smaller than the coupling's rated torque. Please note.
*1: Correction of rated torque due to load fluctuation is not required. For more detailed information, please refer to Selection Guidelines.

※ The shaft's slip torque may be smaller than the coupling's rated torque depending on the shaft bore.

*2: These are values with max. bore diameter.

Slip torque

As in the table below, the clamping type MSXP-C has different slip torque according to the bore diameter. Take care during selection.

Unit : N・m

Part Number Bore Diameter (mm)
6 8 10 12 14 15
MSXP-25C 0.5 0.6 0.7
MSXP-30C 0.8 1.1 1.5
MSXP-36C 0.7 1.2 1.8 2.2

These are test values based on the conditions of shaft dimensional allowance: h7, hardness: 34-40 HRC, and screw tightening torque of the values described in MSXP-C dimension tables. They are not guaranteed values.
Slip torque changes with usage conditions. Carry out tests under conditions similar to actual conditions in advance.


Clamping Type


MSXP-C_CCleanroom / Vacuum / Heat Resistant Couplings - Slit Type (PEEK)


Main Body PEEK (Polyether Ether Ketone)
Hex Socket Head Cap Screw PEEK (Polyether Ether Ketone)

PEEK's color may vary depending on the lot or other matters.


  • Property
Low Particle
Low Outgas
Chemical Resistance
Zero Backlash
Allowable Misalignment
Electrical Insulation
Cleanroom Specification
Allowable Operating Temperature -20℃ to 80℃

◎: Excellent ○: Very good

  • This is a resin spring coupling with single-piece construction.
  • It can be used in an environment or cleanroom where heat resistance and chemical resistance are required, such as FPD manufacturing equipment.
  • PEEK superior in physical and chemical properties is adopted. Outgas quantity is extremely low.
  • A plate spring formed by a slit allows eccentricity, angular misalignment, and end-play to be accepted.


FPD manufacturing device / Semiconductor manufacturing device

PEEK's Physical Properties

Chemical Name PEEK
10% Hydrochloric Acid
10% Sulfuric Acid
50% Sulfuric Acid ×
10% Nitric Acid
50% Nitric Acid ×
50% Hydrofluoric Acid ×
10% Phosphoric Acid
Formic Acid
10% Acetic Acid
Citric Acid
Chromic Acid
Boric Acid
Methyl Alcohol
10% Sodium Hydroxide
10% Potassium Hydroxide
Calcium Hydroxide
Hydrogen Sulfide (gas)
Sulfur Dioxide
Ammonium Nitrate
Sodium Nitrate
Calcium Carbonate
Calcium Chloride
Magnesium Chloride
Magnesium Sulfate
Zinc Sulfate
Hydrogen Peroxide

○: Available △: Available depending on conditions ×: Not available
This is test data with a specimen used at room temperature (23°C).
Chemical resistance changes with performance conditions. Always carry out tests under performance conditions similar to actual conditions in advance.

Analysis of Outgas

Unit : (v/v ppm)

Component Content
Inorganic Gas Hydrogen 500 or Less
Carbon Monoxide 500 or Less
Carbon Dioxide 500 or Less
Organic Gas Methane 5 or Less
Ethane 5 or Less
Ethylene 5 or Less
Propane 5 or Less
Acetylene 5 or Less
i-Butane 5 or Less
n-Butane 5 or Less
Propylene 5 or Less

Both inorganic gas and organic gas are not more than the lower limit of determined amount and are not detected.

  • Measurement Method
    Inorganic gas----Gas chromatography (TCD)
    Organic gas----Gas chromatography (FID)
  • Measurement Conditions
    Heating temperature----100°C

MSXP-C_TTechnical Information

Eccentric Reaction Force

MSXP-C_TTechnical Information

Thrust reaction force

MSXP-C_TTechnical Information

Change in static torsional stiffness due to temperature

MSXP-C_TTechnical Information

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